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MIT has devised a way of creating complex, self-assembling 3D nanostructures of wires and junctions. While self-assembling structures have been made from polymers before, this is the first time that multi-layer, configurable layouts have been created, opening up the path to self-assembled computer chips.

The science behind these self-assembling 3D structures is rather complex. Basically, MIT uses diblock copolymers, which are large molecules formed from two distinct polymers (each with different chemical and physical properties). These copolymers naturally form long cylinders — wires.

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ExtremeTech